CISA HBOM Framework Doesn’t Go Far Enough

CISA HBOM Framework Doesn't Go Far Enough

February 15, 2024 at 04:12PM

CISA’s hardware bill of materials (HBOM) framework aims to address semiconductor chip security but is deemed insufficient. While it supports supply chain management and risk assessment, it lacks life cycle tracking and fails to address vulnerabilities like Downfall. Despite early shortcomings, CISA’s initiative is a step towards bolstering chip security but requires further enhancement.

From the meeting notes, the main takeaways are:

1. The recently published hardware bill of materials (HBOM) framework from the Cybersecurity and Infrastructure Security Agency (CISA) is seen as a positive step but is thought to have limitations in ensuring semiconductor chip security.

2. The framework is acknowledged for offering a consistent and repeatable way for vendors and purchasers to communicate about hardware components, critical for supply chain management and risk assessment, but it was noted that it must go beyond the manufacturing of semiconductor devices to provide robust security against emerging cyber threats.

3. An example of a vulnerability was given in the form of the Downfall vulnerability which affected microprocessors manufactured in 2015, highlighting the need for a more thorough HBOM framework with additional life cycle traceability to address such vulnerabilities effectively.

4. CISA’s HBOM framework was commended for encouraging businesses to detail their upstream sourcing and for the role it plays in ensuring chip security, but concerns were raised about its scope not extending to the end of the chip’s life cycle.

5. It was emphasized that hardware vulnerabilities can remain dormant for years, underscoring the importance of complete visibility into the manufacturing and entire life cycle of the chip to enable proactive monitoring and rapid response to flaws.

These takeaways illustrate the level of concern and the need for a more comprehensive HBOM framework to address the security challenges associated with semiconductor chips effectively.

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